Description
Ultra-thin, DSEK/DSAEK endothelium inserting device, for lenticle thickness, below < 180 micron. Both models can be disassembled for proper post-op cleaning and maintenance. 3.5 mm incision
Ultra-thin, DSEK/DSAEK endothelium inserting device, for lenticle thickness below < 180 micron.
Both models can be disassembled for proper post-op cleaning and maintenance.
3.5 mm incision
Ultra-thin, DSEK/DSAEK endothelium inserting device, for lenticle thickness, below < 180 micron. Both models can be disassembled for proper post-op cleaning and maintenance. 3.5 mm incision